Electronic device

ABSTRACT

An electronic device is provided. The electronic device includes a substrate; a plurality of first light-emitting elements disposed in a first area of the substrate; a plurality of second light-emitting elements disposed in a second area of the substrate; a first power line disposed on the substrate and electrically connected to the plurality of first light-emitting elements; a second power line disposed on the substrate and electrically connected to the plurality of second light-emitting elements; a first circuit connecting element electrically connected to the first power line; and a first power supply element electrically connected to the first circuit connecting element. A projection of the first area on the substrate does not overlap a projection of the second area on the substrate, and the first area is closer to the first circuit connecting element than the second area.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims priority of U.S. Provisional Patent ApplicationSer. No. 62/741,010, filed Oct. 4, 2018, the entire disclosures of whichis hereby incorporated by reference herein. This application claimspriority of China Patent Application No. 201910359564.7, filed on Apr.30, 2019, the entirety of which is incorporated by reference herein.

BACKGROUND Technical Field

The disclosure relates to an electronic device. In particular, thedisclosure relates to an electronic device having an array composed oflight-emitting elements.

Description of the Related Art

In order to let users interact with their electronic devicesintuitively, a display device is a necessary part of current electronicdevices.

An array composed of light-emitting elements may serve as a displaypanel, e.g., a light-emitting diode display (LED display), or it mayserve as a back light source of a non-self-luminous display device (suchas liquid-crystal display, LCD display). Therefore, no matter whether itis employed in a self-luminous display device or in a non-self-luminousdisplay device requiring a back light source, an array composed oflight-emitting elements plays a significant role.

Although existing light-emitting element arrays have been generallyadequate for their intended purposes, they have not been entirelysatisfactory in all respects. Therefore, an improvement upon existinglight-emitting element arrays is still desired.

SUMMARY

In accordance with some embodiments of the present disclosure, thepresent disclosure provides an electronic device, including a substrate;a plurality of first light-emitting elements disposed in a first area ofthe substrate; a plurality of second light-emitting elements disposed ina second area of the substrate; a first power line disposed on thesubstrate and electrically connected to the plurality of firstlight-emitting elements; a second power line disposed on the substrateand electrically connected to the plurality of second light-emittingelements; a first circuit connecting element electrically connected tothe first power line; and a first power supply element electricallyconnected to the first circuit connecting element. A projection of thefirst area on the substrate does not overlap a projection of the secondarea on the substrate, and the first area is closer to the first circuitconnecting element than the second area.

A detailed description is given in the following embodiments withreference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure may be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIGS. 1 to 7 are schematic top-views of electronic devices 10, 30, 40,50, 60, 70 and 80 respectively in accordance with some embodiments ofthe present disclosure.

DETAILED DESCRIPTION

The display device and the fabricating method thereof provided in thepresent disclosure are described in the following detailed description.In the following detailed description, it should be noted that one ormore embodiments are provided to illustrate the present application. Thespecific elements and configurations described in the following detaileddescription are merely used to clearly describe the present disclosure,and the scope of the present application is not intended to be limitedby the specific element and configuration. Features in differentembodiments may be combined as long as the combination does not violatethe spirit of the present disclosure. In addition, various embodimentsmay use like reference numerals to clearly describe the presentdisclosure. However, the like reference numerals does not indicate acorrelation between various embodiments and structures.

It should be noted that the elements or devices in the drawings of thepresent disclosure may be present in any form or configuration known tothose with ordinary skill in the art. In addition, in thisspecification, relative expressions are used. For example, “lower”,“bottom”, “higher” or “top” are used to describe the position of oneelement relative to another. It should be appreciated that if a deviceis flipped upside down, an element that is “lower” will become anelement that is “higher”. The description of the exemplary embodimentsis intended to be read in connection with the accompanying drawings,which are to be considered part of the entire written description. Itshould be noted that the drawings are not drawn to scale. In addition,structures and devices are shown schematically in order to simplify thedrawing and clearly express the features.

It should be understood that, although the terms first, second, thirdetc. may be used herein to describe various elements, components,regions, layers, portions and/or sections, these elements, components,regions, layers, portions and/or sections should not be limited by theseterms. These terms are only used to distinguish one element, component,region, layer, portion or section from another element, component,region, layer or section.

Thus, a first element, component, region, layer, portion or sectiondiscussed below could be termed a second element, component, region,layer, portion or section without departing from the teachings of thepresent disclosure.

The terms “about” and “substantially” typically mean +/−5% of the statedvalue, more typically +/−3% of the stated value and even more typically+/−1% of the stated value, more typically +/−2% of the stated value,more typically +/−1% of the stated value and even more typically +/−0.5%of the stated value. The stated value of the present disclosure is anapproximate value. When there is no specific description, the statedvalue includes the meaning of “about” or “substantially”.

In some embodiments of the present disclosure, terms concerningattachments, coupling and the like, such as “connected” and“interconnected,” refer to a relationship wherein structures are securedor attached to one another either directly or indirectly throughintervening structures, as well as both movable or rigid attachments orrelationships, unless expressly described otherwise. In addition, itshould be understood that terms concerning covering and the like referto a relationship wherein the covered object may be directly contacted,or may be a portion of projection of the covered object overlaps aprojection of a covering object, while the covering object and thecovered object do not directly contact with each other.

In a light-emitting array, as a display area increases, a requiredcorresponding light-emitting area should be increased as well.Therefore, the length of the wire on the substrate is getting longer,and thus the driving current of the light-emitting elements on the samewire that is remote from a power supply component is lower than thedriving current of the light-emitting component that is closer to thepower supply component. It will result in that the luminous intensity ofthe light-emitting elements remote from the power supply component isweaker than that of the light-emitting elements close to the powersupply component. The luminous intensity of the whole light-emittingarray become uneven and a display device including such a light-emittingarray may not provide desirable watching experience due to theaforementioned reason.

Therefore, by adjusting the configuration of wires in the light-emittingarray, the present disclosure provides an electronic device which mayreduce the effect of impedance (or resistance) on the luminousintensity, such that the light-emitting elements in different areas maystill have close/or the same luminous intensity.

It should be noted that the term “array” may be any suitablearrangement. For example, in some embodiments of the present disclosure,the “array” may be a rectangular array. Under some circumstances, thearray may be a single row rectangular array or a single columnrectangular array, such as a 1×n array wherein n is an integer which isequal to or greater than 2. Under some circumstances, the array may be asquare array (m×m) or other kinds of rectangular arrays (m×n), wherein mand n are integers which are equal to or greater than 2, and m isdifferent from n. Under some circumstances, the array may be a trapezoidarray, a hexagon array, or any kind of array that the relative positionsof the light-emitting elements are arranged regularly or randomly. Insome embodiments, the light-emitting elements may be disposed unevenly.For clarity purposes, the light-emitting elements in figures of thepresent disclosure are all arranged in a rectangular array.

Referring to FIG. 1, a schematic top-view of the electronic device 10 isshown. Namely, FIG. 1 is a schematic top-view by observing theelectronic device 10 along the normal direction of a substrate 100 (Zdirection in FIG. 1). In some embodiments, the electronic device 10 mayinclude a substrate 100, a plurality of first light-emitting elements101 a, a plurality of second light-emitting elements 101 b, a firstpower line 102 a, a second power line 102 b, a first circuit connectingelement 103 a and a first power supply element 104 a. A first area A1and a second area A2 may be defined on the substrate 100. The first areaA1 and the second area A2 are defined in a manner that in a top view ofthe electronic device 10, using a first side S1 of the substrate 100which is closest to the first circuit connecting element 103 a as areference line, the substrate 100 may be divided by a line L1 parallelto the first side S1 into the first area A1 and the second area A2. Thefirst area A1 is closer to the first circuit connecting element 103 athan the second area A2. If the first light-emitting elements 101 a arearranged in a staggered way, the first side S1 may not be a straightline, so the line L1 may not be a straight line either, and may varydepending on the requirement of the design. The present disclosure isnot particularly limited.

Still referring to FIG. 1, the plurality of the first light-emittingelements 101 a and the plurality of the second light-emitting elements101 b are disposed on the substrate 100. The plurality of the firstlight-emitting elements 101 a are disposed in the first area A1 of thesubstrate 100, and the plurality of the second light-emitting elements101 b are disposed in the second area A2. Therefore, it can be regardedthat the first area A1 is defined by the plurality of the firstlight-emitting elements 101 a; and the second area A2 is defined by theplurality of the second light-emitting elements 101 b. Since theprojection of the first area A1 on the substrate 100 and does notoverlap the projection of the second area A2 on the substrate 100, thefirst light-emitting elements 101 a and the second light-emittingelements 101 b would not be arranged in a staggered way (such asalternately) along the Y direction.

In some embodiments, as shown in FIG. 1, when the first light-emittingelements 101 a and the second light-emitting elements 101 b are arrangedto form a rectangular array (such as a 9×5 rectangular array as shown inFIG. 1), among the light-emitting elements in the same column (along Ydirection in FIG. 1), there is a minimum distance D_(101b) between oneof the second light-emitting elements 101 b and the first circuitconnecting element 103 a, and there is a minimum distance D_(101a)between one of the first light-emitting elements 101 a and the firstcircuit connecting element 103 a. The minimum distance D_(101b) isgreater than the minimum distance D_(101a).

Still referring to FIG. 1, in some embodiments, a first power line 102 aof the electronic device 10 is disposed on the substrate 100 andelectrically connected to the first light-emitting elements 101 a. Asecond power line 102 b is also disposed on the substrate 100 andelectrically connected to the second light-emitting elements 101 b. Inthe present disclosure, the power line that electrically connects thefirst light-emitting elements 101 a in the first area A1 is defined asthe first power line 102 a. The power line that electrically connectsthe second light-emitting elements 101 b in the second area A2 isdefined as the second power line 102 b. In the embodiments as shown inFIG. 1, there are five first power lines 102 a in the first area A1 andfive second power lines 102 b in the second area A2, but the disclosureis not limited thereto and may be adjusted depending on actual need. Thefirst power lines 102 a is electrically connected to the first powersupply element 104 a through the first circuit connecting element 103 a.In addition, it should be noted that the position of the power lines isonly for illustrative purposes, but the disclosures is not limitedthereto. For example, the power lines may not be straight lines, and thecorner may not be a right angle. The corner may be an arc shape todecrease the probability of electrostatic discharge, or may be any othersuitable shape or angle.

The first circuit connecting element 103 a may be any suitable elementwhich is capable of electrically connecting the first power line 102 aand the first power supply element 104 a. For example, the first powerline 102 a and the first power supply element 104 a may be electricallyconnected by means of a flexible printed circuit (FPC), a flexible flatcable (FFC), a metal wire (such as a wire including gold, silver,copper, iron, lead, chromium, tin, molybdenum, neodymium, titanium,tantalum, an alloy thereof, or a combination thereof). The electricallyconnecting may be conducted in any suitable way. For instance, toelectrically connect the first circuit connecting element 103 a and thefirst power lines 102 a, an anisotropic conductive film (ACF) may befirst applied to the position of the first power lines 102 a to beconnected, and then the first circuit connecting element 103 a may bedisposed on the anisotropic conductive film followed by a hot pressingprocess to achieve the electrical connection. The anisotropic conductivefilm described herein is a conductive film formed by a polymer layerpossessing anisotropic conductivity and adhesivity (such as a film typeadhesive formed by dispersing conductive particles in an epoxy resin),which enables conduction vertically (along the direction of the filmthickness) and insulation between terminals (along the direction of thefilm width). When the first circuit connecting element 103 a is a mealwire, the electrical connection between the elements could be achievedby soldering.

The first power supply element 104 a in the electronic device 10 may bea driving circuit providing a driving voltage for the firstlight-emitting elements 101 a and the second light-emitting elements 101b, wherein the driving circuit may be disposed on any suitable circuitsubstrate. For example, the circuit substrate of the first power supplyelement 104 a may be a print circuit board (PCB), a metal core PCB(MCPCB), a ceramic PCB, or a directed bonded copper substrate (DBC). Insome embodiments, the circuit substrate of the first power supplyelement 104 a may be disposed on the back side of the substrate 100 (theside where the first light-emitting elements 101 a and the secondlight-emitting elements 101 b are not disposed). The first power supplyelement 104 a electrically connects the first power line 102 a throughthe first circuit connecting element 103 a, which allows the first powersupply element 104 a to provide driving signals to the first power line102 a.

Still referring to FIG. 1, the second power line 102 b in the electronicdevice 10 electrically connect to the part P102 a of the first powerline 102 a where has yet to load the first light-emitting elements 101 a(for example, the part P102 a may be a portion of the first power line102 a between the first circuit connecting element 103 a and the firstlight-emitting elements 101 a which are closest to the first circuitconnecting element 103 a), so as to form a parallel circuit between thesecond light-emitting elements 101 b and the first light-emittingelements 101 a. In some embodiments as shown in FIG. 1, the connectingpoint P between the second power line 102 b and the part P102 a of thefirst power line 102 a where has yet to load the first light-emittingelements 101 a is located between the first light-emitting elements 101a and the first circuit connecting element 103 a.

It should be noted that if other kinds of circuit connectingarrangements are used, for example, the second power line 102 b in FIG.1 directly connects the terminal of the first power line 102 a, when thedriving current is supplied from the first power supply element 104 a tothe remote second light-emitting element 101 b in the second area A2,since the current needs to pass through the first power line 102 abefore arriving to the second power line 102 b, the loading caused bythe first light-emitting elements 101 a on the first power line 102 awill increase the impedance (resistance) of the first power line 102 a.Therefore, the brightness of the second light-emitting elements 101 b inthe second area A2 will be lower than that of the first light-emittingelements 101 a in the first area A1. The brightness of the firstlight-emitting elements 101 a and the second light-emitting elements 101b decreases along the Y direction, which causes a problem of unevenbrightness.

Compared with the above circuit connecting arrangement, the second powerline 102 b electrically connecting the second light-emitting elements101 b does not directly contact the terminal part of the first powerline 102 a, but electrically connects the part P102 a of the first powerline 102 a where has yet to load the first light-emitting elements 101 a(for example, the part P102 a may be a portion of the first power line102 a between the first circuit connecting element 103 a and the firstlight-emitting elements 101 a which are closest to the first circuitconnecting element 103 a). Thus, the connection of the first circuitline 102 a and the second circuit line 102 b precedes the connection ofthe first circuit line 102 a and the first light emitting elements 101a. Therefore, when the first power supply element 104 a supplies currentto the second light-emitting elements 101 b in the second area A2, thecurrent does not have to pass the portion of first power line 102 awhere is loaded with the first light-emitting elements 101 a beforearriving at the second power line 102 b and the second light emittingelements 101 b. Therefore, the impedance (resistance) of the secondcircuit line 102 b in the electronic device 10 may be reduced, so thebrightness of the second light-emitting elements 101 b of the secondarea A2 in the electronic device 10 would not fall excessively, and mayhave a brightness close to that of the first light-emitting elements 101a of the first area A1. As such, the first area A1 and the second areaA2 at a remote distance of the electronic device 10 may produce arelatively close brightness.

In some embodiments, the number of second light-emitting elements 101 bloaded on the second power line 102 b is lower than the number of firstlight-emitting elements 101 a loaded on the first power line 102 a. Insome other embodiments, when the first light-emitting elements 101 a andthe second light-emitting elements 101 b together to form a rectangulararray, the number of second light-emitting elements 101 b on the samerow (along Y direction in FIG. 1) is less than the number of firstlight-emitting elements 101 a. As such, the luminous intensity(brightness) of the second light-emitting elements 101 b in the secondarea A2 can be further adjusted or the overall brightness uniformity ofthe light-emitting array can be improved.

The substrate 100 described in the present disclosure may be anysuitable rigid or flexible substrate that is capable of carrying withlight-emitting elements. The materials of the substrate 100 may beglass, ceramics (such as tantalum carbide, aluminum nitride), sapphire,plastic (such as fiberglass-reinforced plastics (FRP), polyester film,polyethylene terephthalate (PET), polyethylene naphthalate (PEN) andpolyethersulfone (PES), an acrylic resin film, or any other suitablematerial for the substrate.

In some embodiments, the first power line 102 a and the second powerline 102 b may be formed on the substrate 100 by one or more depositionprocesses, photolithography processes, and etching processes, when thematerial of the substrate 100 is suitable for or is required accordingto actual need. For example, in some embodiments, the deposition processmay include a chemical vapor deposition process, a physical vapordeposition process, an electroplating process, an electroless platingprocess, other suitable processes, or a combination thereof, but is notlimited thereto. The physical vapor deposition process may include, butis not limited to, a sputtering process, an evaporation process, pulsedlaser deposition, and the like processes. In addition, in someembodiments, the photolithography process may include photoresistcoating (e.g., spin coating), soft baking, hard baking, mask alignment,exposure, post-exposure baking, photoresist development, cleaning anddrying. In some embodiments, the etching process mentioned aboveincludes a dry etch process, a wet etch process, or other suitable etchprocesses. In some other embodiments, the first power line and thesecond first power line may be a single metal layer or a multi-layeredmetal structure.

The material of first power line 102 a and the second power line 102 bis not particularly limited as long as the material possessesconductivity. For example, it may be formed of a metallic conductivematerial, an amorphous silicon, a polycrystalline silicon, a metalnitride, a conductive metal oxide, or a combination thereof. In someembodiments, the metallic conductive material may include copper,silver, tin, aluminum, molybdenum, tungsten, gold, chromium, nickel,platinum, copper alloy, silver alloy, tin alloy, aluminum alloy,molybdenum alloy, tungsten alloy, gold alloy, chromium alloy, nickelalloy, platinum alloy, other suitable electrically conductive materials,or a combination thereof, but is not limited thereto. The metal nitridesmay include, but are not limited to, molybdenum nitride, tungstennitride, titanium nitride, and tantalum nitride. The conductive metaloxide may include, but is not limited to, ruthenium oxide, indium zincoxide, indium gallium zinc oxide (IGZO), indium tin zinc oxide (ITZO),antimony tin oxide (ATO), aluminum zinc oxide (AZO), aluminum zincoxide, zinc oxide, and indium tin oxide.

The first light emitting element 101 a and the second light emittingelement 101 b may be any suitable light emitting device. For example,the light emitting device may include an electroluminescence (EL)element (such as an organic EL element or an inorganic EL element), anorganic light emitting diode (OLED), and an inorganic light emittingdiode (Light-emitting diode, LED) (for example: micro LED, mini LED), aquantum dot light emitting diode (Q-LED), a laser diode (LD), and so on.

Next, please refer to FIG. 2. FIG. 2 is a schematic top-view of anelectronic device 30 in accordance with some embodiments of the presentdisclosure. The electronic device 30 is substantially the same as theelectronic device 10 of FIG. 1 except that the width W_(102b) of thesecond power line 102 b extending in the X direction is greater than thewidth W_(102a) of the first power line 102 a extending in the Xdirection. As such, the impedance (resistance) of the second power line102 b can be further reduced, and by making the impedance (resistance)of the second power line 102 b lower than the impedance (resistance) ofthe first power line 102 a, the luminous intensity of the second lightemitting elements 101 b at farther place may be much closer to that ofthe first light emitting elements 101 a, so as to enhance the overallbrightness uniformity. When the first power line 102 a and the secondpower line 102 b have a multi-layered structure, the widths W_(102a) andW_(102b) are the maximum widths of the multi-layered structure.

In some other embodiments, the thickness of the second power line 102 bmay be greater than the thickness of the first power line 102 a, and theimpedance (resistance) of the second power line 102 b may be reduced. Insome embodiments, the thickness of the second power line 102 b and thewidth W_(101b) of the second power line 102 b extending in the Xdirection may be greater than the thickness of the first power line 102a and the width W_(102a) of the first power line 102 a extending in theX direction, respectively. That is, as long as the cross-sectional areaof the second power line 102 b is greater than the cross-sectional areaof the first power line 102 a, the purpose of making the impedance(resistance) of the second power line 102 b lower than the impedance ofthe first power line 102 a may be accomplished. In some embodiments, thewidth W_(102b) of the second power line 102 b extending in the Xdirection is between 200% and 600% of the width W_(102a) of the firstcircuit supply line 102 a extending in the X direction. In someembodiments, the thickness of the second power line 102 b is between200% and 600% of the thickness of the first power line 102 a. When thefirst power line 102 a and the second power line 102 b aremulti-layered, the widths W_(102a) and W_(102b) are the maximum width ofthe multi-layered structure, and the thickness thereof is the totalthickness of the first power line 102 a and the total thickness of thesecond power line 102 b.

In some other embodiments, the first power line 102 a and the secondpower line 102 b may be formed of different materials. For example, theimpedance (resistance) of the second power line 102 b material is lessthan the impedance (resistance) of the first power line 102 a material.In such a case, even if the cross-sectional area of the first power line102 a and that of the second power line 102 b are the same, theimpedance (resistance) of the second power line 102 b may still be lowerthan the impedance (resistance) of the first power line 102 a. In someembodiments, the impedance (resistance) of the second power line 102 bmaterial may be 1% to 30% of the impedance (resistance) of the firstpower line 102 a material.

Next, please refer to FIG. 3. FIG. 3 is a schematic top-view of anelectronic device 40 in accordance with further embodiments of thepresent disclosure. The electronic device 40 is substantially the sameas the electronic device 30 in FIG. 2, and the difference is that partof the power line 102 b and the part of the power line 102 a loaded withthe first light-emitting elements 101 a (that is, the portion except thepart P102 a in FIG. 1) overlaps in the normal direction of a mainsurface of the substrate 100 (in the Z direction in FIG. 3), that is,when the substrate 100 is viewed from its top, the second power line 102b covers a portion of the first power line 102 a (the portion of thepower line 102 a covered by the second power line 102 b is indicated bya broken line in FIG. 3). In the overlap portion, an insulating layermay be disposed between the first power line 102 a and the second powerline 102 b to provide electrical isolation between them. A via hole h inthe insulating layer may be formed to electrically connect a portion ofthe first power line 102 a to a portion of the second power line 102 bthat are required to be electrically connected. With such a circuitarrangement, the area of the substrate occupied by the first power line102 a and the second power line 102 b can be greatly reduced, and thedistance between the adjacent two rows (arranged in the Y direction) canbe decreased, and thereby the number of light-emitting elements per unitarea may be further increased and the resolution or brightness per unitarea will be improved as well.

The material of the insulating layer is not particularly limited as longas it can electrically isolate the first power line 102 a and the secondpower line 102 b. For example, it may be silicon oxide, silicon nitride,silicon oxynitride, metal oxide, metal nitride, metal silicide,transition metal oxide, transition metal nitride, transition metalsilicide, metal oxynitride, metal aluminate salt, zirconium silicate,any other suitable material, or a combination thereof. In someembodiments, the insulating layer may be formed by, for example,chemical vapor deposition (CVD), physical vapor deposition (PVD), orspin coating, wherein the physical vapor deposition may be implementedby evaporation, sputtering, and so on. The chemical vapor deposition maybe low pressure chemical vapor deposition (LPCVD), plasma enhancedchemical vapor deposition (PECVD) or other general methods.

Next, please refer to FIG. 4. FIG. 4 is a schematic top-view ofelectronic device 50 in accordance with some embodiments of the presentdisclosure. The electronic device 50 may be considered to be twoelectronic devices 10 disposed side-by-side and both of the devicesshares the same first power supply element 104 a. Therefore, in additionto the original first light-emitting element 101 a, the secondlight-emitting element 101 b, the first power line 102 a, and the secondpower line 102 b, the substrate 100 further includes other firstlight-emitting elements 101 a′ and other second light-emitting elements101 b′, the other first power line 102 a′, and the other second powerline 102 b′.

The first light-emitting elements 101 a′ are also disposed in the firstarea A1 of the substrate 100; and the second light-emitting elements 101b′ are also disposed in the second area A2 of the substrate 100. Thefirst power line 102 a′ is disposed on the substrate 100 andelectrically connected to the first light emitting element 101 a′. Thesecond power line 102 b′ is disposed on the substrate 100 andelectrically connected to the second light emitting element 101 b′. Thefirst power line 102 a′ is electrically connected to the second circuitconnecting element 103 b, and the second circuit connecting element 103b is electrically connected to the first power supply element 104 a.

The first light emitting element 101 a′, the second light emittingelement 101 b′, the first power line 102 a′, the second power line 102b′, and the second circuit connecting element 103 b may be formed in asimilar manner and of similar material of the first light emittingelement 101 a, the second light emitting element 101 b, the first powerline 102 a, the second power line 102 b and the second circuitconnecting element 103 b, and thus the details of these elements willnot be repeated here.

As shown in FIG. 4, the electronic device of the present disclosure maybe expanded by aforementioned configuration according to therequirements of the actual product. Therefore, the electronic device ofthe present disclosure may also be applied to some large-sized displaydevices. It should be noted that the present disclosure is notparticularly limited to two partitions, and if necessary, there may bemultiple partitions without violating the spirit of the presentdisclosure.

Next, please refer to FIG. 5. The electronic device 60 of FIG. 5 is aschematic top-view according to some embodiments of the presentdisclosure. The electronic device 60 has substantially the sameconfiguration with the electronic device 10, except that the electronicdevice 60 further includes a data line 105 and a data driving element106 in order to further control the first light emitting elements 101 aand the second light emitting elements 101 b on the substrate 100. Thedata driving element 106 is electrically connected to the firstlight-emitting elements 101 a and the second light-emitting elements 101b through the data line 105 to supply the data signal to the firstlight-emitting elements 101 a and the second light-emitting elements 101b. The data driving element 106 may be disposed on a suitable circuitsubstrate (such as the circuit substrate of the first power supplyelement 104 a), and the data driving element 106 may also include anintegrated circuit chip. The integrated circuit chip may be disposed ona circuit connecting element (not shown) connecting the circuitsubstrate and the substrate 100 by flip chip technology (for example,the chip on film (COF)), or directly formed on the circuit connectingelement by related thin film processes. In some embodiments, the dataline 105 of the electronic device 60 may be formed in the same manner aspreviously described to form the first power line 102 a and the secondpower line 102 b, and the circuit connection element may be an elementwhich is similar to the first circuit connecting element 103 apreviously described.

As shown in FIG. 5, in some embodiments, when the first light-emittingelements 101 a and the second light-emitting elements 101 b form arectangular array, the data lines 105 may be electrically connected tothe driving circuit of the first light-emitting elements 101 a and thedriving circuit of the second light-emitting element 101 bsimultaneously, wherein the first light-emitting elements 101 a and thesecond light-emitting element 101 b are in the same column (arrangedalong the Y direction in FIG. 5).

Next, please refer to FIG. 6. FIG. 6 is a schematic top-view of anelectronic device 70 in accordance with some embodiments of the presentdisclosure. In order to make the second light-emitting elements 101 b inthe second area A2 and the first light-emitting elements 101 a in thefirst area A1 have close luminous intensity, the electronic device 70may include a second circuit connecting element 103 b electricallyconnected to the second power line 102 b, and a second power supplyelement 104 b electrically connected to the second circuit connectingelement 103 b. Thus, the driving current can be respectively supplied tothe second light-emitting elements 101 b in the second region A2 and thefirst light-emitting elements 101 a in the first region A1 by differentpower supply elements. Since the first power supply element 104 a doesnot need to simultaneously drive the first light-emitting elements 101 aand the second light-emitting elements 101 b, the luminous intensity ofthe second light-emitting elements 101 b may be further adjusted to makethe first light-emitting elements 101 a and the second light-emittingelements 101 b have similar luminous intensities or improve the overallbrightness uniformity of the light-emitting element array. In someembodiments, the second power supply element 104 b may be closer to thesecond area A2 than the first area A1. The second circuit connectingelement 103 b and the second power supply element 104 b may be similarto the first circuit connecting element 103 a and the first power supplyelement 104 a respectively described above, and thus the details ofthese elements will not be repeated herein.

Next, please refer to FIG. 7. FIG. 7 is a schematic top-view of theelectronic device 80 in accordance with some embodiments of the presentdisclosure. In some embodiments, the electronic device 80 may include athird power line 102 c, and the second power line 102 b may beelectrically connected to the first power supply element 104 a throughthe third power line 102 c. By this circuit arrangement, the secondpower line 102 b may be electrically connected to the first power supplyelement 104 a directly, and do not have to pass the first power line 102a. Therefore, the driving current that provided by the first powersupply element 104 a will not be diminished by the impedance(resistance) of the first power line 102 a on which the firstlight-emitting elements 101 a are loaded. Thus, the luminous intensityof the second light-emitting elements 101 b in the second region A2 arenot excessively decreased, so that the electronic device as a whole hasa uniform luminous intensity or the overall brightness uniformity of thelight-emitting array may be improved. It should be noted that there isno electrical connection between the power line 102 c and the firstpower line 102 a in FIG. 7.

In some embodiments, the material and the fabrication method of thethird power line 102 c of the electronic device 80 may be similar to thefirst power line 102 a and the second power line 102 b previouslydescribed. For example, in some embodiments, the third power line 102 cmay be a metal wire that is not in direct contact the substrate 100,such as a copper wire that is connected between the second power line102 b and the first power supply element 104 a. That is, at least aportion of the third power line 102 c is not in direct contact with thesubstrate 100. In other embodiments, the material of the third powerline 102 c is different from that of the second power line 102 b, or thethird power line 102 c and the second power line 102 b may havedifferent impedance (resistance). In some embodiments, the impedance(resistance) difference between the third power line 102 c and thesecond power line 102 b ((second power line impedance_((large))−thirdpower line impedance_((small)))/second power lineimpedance_((large)))*100%) may range from 70% to 99%.

According to some embodiments, the electronic device provided by thepresent disclosure may be applied to, for example, a backlight of anon-self-illumination display device, or directly as a display of thedisplay device, but is not limited thereto. For example, the electronicdevice can be applied to a display (such as an OLED display, a QLEDdisplay, a micro LED display, a mini LED display, or a flexibledisplay), a sensing device, a tiled electronic device, or the like.

In summary, the present disclosure provides an electronic device. Theelectronic device may, through adjusting the circuit arrangement, makethe second light-emitting elements remote from the first power supplyelement have a luminous intensity close to the first light-emittingelements close to the first power supply element, or may have animproved uniformity of luminous intensity. The luminous intensity of thewhole light-emitting array may become much more even, so that thelight-emitting array may provide a better viewing experience.

Although some embodiments of the present disclosure and their advantageshave been described in detail, it should be understood that variouschanges, substitutions and alterations can be made herein withoutdeparting from the spirit and scope of the disclosure as defined by theappended claims. For example, it will be readily understood by one ofordinary skill in the art that many of the features, functions,processes, and materials described herein may be varied while remainingwithin the scope of the present disclosure. Moreover, the scope of thepresent application is not intended to be limited to the particularembodiments of the process, machine, manufacture, composition of matter,means, methods and steps described in the specification. As one ofordinary skill in the art will readily appreciate from the presentdisclosure, processes, machines, manufacture, compositions of matter,means, methods, or steps, presently existing or later to be developed,that perform substantially the same function or achieve substantiallythe same result as the corresponding embodiments described herein may beutilized according to the present disclosure. Accordingly, the appendedclaims are intended to include within their scope such processes,machines, manufacture, compositions of matter, means, methods, or steps.

What is claimed is:
 1. An electronic device, comprising: a substratecomprising a first area and a second area; a plurality of firstlight-emitting elements disposed in the first area of the substrate; aplurality of second light-emitting elements disposed in the second areaof the substrate; a first power line disposed on the substrate, and thefirst power line is electrically connected to the plurality of firstlight-emitting elements; a second power line disposed on the substrate,and the second power line is electrically connected to the plurality ofsecond light-emitting elements; a first circuit connecting elementelectrically connected to the first power line; and a power supplyelement electrically connected to the first circuit connecting element;wherein a projection of the first area on the substrate does not overlapa projection of the second area on the substrate, and the first area iscloser to the first circuit connecting element than the second area. 2.The electronic device as claimed in claim 1, wherein the second powerline is electrically connected to the first power line, and theplurality of second light-emitting elements are connected in parallelwith the plurality of first light-emitting elements.
 3. The electronicdevice as claimed in claim 2, wherein a minimum distance between one ofthe second light-emitting elements and the first circuit connectingelement is greater than a minimum distance between one of the firstlight-emitting elements and the first circuit connecting element.
 4. Theelectronic device as claimed in claim 2, wherein the second power lineis electrically connected to a portion of the first power line such thatconnection of the first power line and the second power line precedesconnection of the first power line and the first light emittingelements.
 5. The electronic device as claimed in claim 2, wherein thereare fewer second light-emitting elements than the first light-emittingelements.
 6. The electronic device as claimed in claim 2, whereinimpedance of the second power line is lower than impedance of the firstpower line.
 7. The electronic device as claimed in claim 6, wherein amaterial of the second power line is different from a material of thefirst power line.
 8. The electronic device as claimed in claim 6,wherein a width of the second power line is different from a width ofthe first power line.
 9. The electronic device as claimed in claim 6,wherein a cross-sectional area of the second power line is greater thana cross-sectional area of the first power line.
 10. The electronicdevice as claimed in claim 2, wherein the second power line at leastpartially overlaps the first power line in a top-view of the substrate.11. The electronic device as claimed in claim 10, wherein an insulatinglayer is disposed between the first power line and the second powerline; wherein the first power line is electrically connected to thesecond power line through a via hole in the insulating layer.
 12. Theelectronic device as claimed in claim 2, wherein the electronic devicefurther comprises: another plurality of first light-emitting elementsdisposed in the first area of the substrate; another plurality of secondlight-emitting elements disposed in the second area of the substrate;another first power line disposed on the substrate, and the anotherfirst power line is electrically connected to the another plurality offirst light-emitting elements; another second power line disposed on thesubstrate, and the another second power line is electrically connectedto the another plurality of second light-emitting elements; and a secondcircuit connecting element electrically connected to the another firstpower line; wherein the second circuit connecting element iselectrically connected to the first power supply element.
 13. Theelectronic device as claimed in claim 1, wherein the electronic devicefurther comprises: a second circuit connecting element; and a secondpower supply element; wherein the second power line is electricallyconnected to the second circuit connecting element, and the secondcircuit connecting element is electrically connected to the second powersupply element.
 14. The electronic device as claimed in claim 1, furthercomprising: a third power line, wherein the third power line iselectrically connected to the second power line, and the second powerline is electrically connected to the first power supply element throughthe third power line.
 15. The electronic device as claimed in claim 14,wherein the third power line is a metal wire, and at least part of themetal wire does not directly contact the substrate.
 16. The electronicdevice as claimed in claim 14, wherein a material of the third powerline is different from a material of the second power line.
 17. Theelectronic device as claimed in claim 14, wherein an impedancedifference between the third power line and the second power line rangesfrom 70% to 99%.
 18. The electronic device as claimed in claim 1,further comprising: a data line; and a data driving element, wherein thedata driving element is electrically connected to the firstlight-emitting elements and the second light-emitting elements throughthe data line.
 19. The electronic device as claimed in claim 18, whereinthe first light-emitting elements and the second light-emitting elementselectrically connected to the data line are in the same column.
 20. Theelectronic device as claimed in claim 1, wherein the firstlight-emitting elements and the second light-emitting elements togetherform a rectangular array.